Data Process Center		Plotter
Microsoft Windows NT Computer Systems with CAM 350 program of our Data Process Applications department, which includes the first stage of production planning forms is the beginning of our perfect service.		Technical drawings, which are prepared in the CAM station after the necessary research, are transformed into film outputs with Gerber Laser Plotter.

 

Laminate Cutting		Stencil Preperation
The pertinax laminates are cutting and measuring with very sensitively.		The stencils for printing process are prepared here according to the films.

 

Tooling Department		Punching Department
The punching tools are built according to the data’s transmitted from the data process center.		Printed Circuit boards, whose molds are prepared at the production planning stage according to the customer requests, are subjected to mechanical punching and cutting operations in our punching department.

 

CNC Drilling - Cutting		Etch Print
We give fast and best quality service with our CNC counters, which are equipped with high technology.		The panels are etch printed after surface cleaning.

 

Etching Process		Optical Controlled Drilling
The etching process of the boards, which are subjected to etch printing are done in this department.		The reference holes are drilled here for printing and mechanical process with our optically controlled robots.

 

Surface Cleaning		Printing Process
The surface cleaning of the panels before printing process are accurately done here.		Solder mask, insulating, carbon and component prints are done and optically controlled this department.

 

Through Hole Plating		Photographic Processes
Through hole plating of single and double-sided PCBs are done. Firstly Black Hole process and then electrolytic copper coating are applied.		Coating of dry film, posing, printing of solder mask, etc, which are related to the production of double-sided cards are performed in conditioned areas, where working conditions such as moisture and heat are constant.

 

Hal Soldering		V-Scoring
Vertical soldering of single and double sided cards are done. (%63 tin-37 lead) solder plating and SAC 305 (%96,5 tin, %3 silver - %0,5 copper) are used in this processes.		The boards which are demanded as multi panels are subjected to V-Scoring operation.

 

Bareboard Testing		Organic Coating
PCBs, which are finished with production process are subjected to bare-board testing before packing and general control.		One of the latest technologies, which allow you to achieve a perfect solderability with passivated copper surface.

 

Quality Control		Packing
Cards are subjected to process control after each process and at the end of production.		Finished products after passing all the production and quality control processes are, packaged to be delivered to the customers.